Method and apparatus for monitoring wafer characteristics and/or semiconductor processing consistency using wafer charge distribution measurements
US6232134A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2000 |
| Grant date | May 15, 2001 |
| Priority date | — |
| Expiry date | Jan 24, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for characterizing processing operations is presented. Following exposure of a wafer to plasma, the surface charge distribution pattern on the wafer is measured. The surface charge distribution pattern on the wafer is then compared with known surface charge distribution patterns to determine if the measured charge distribution pattern correlates to desirable patterns associated with successful performance of one or more processing steps. In some embodiments, the comparison of the measured charge distribution pattern can be used to detect specific problems in one or more processing steps such that corrective action can be taken in a timely manner. The comparison between the measured charge distribution pattern and known charge distribution patterns may be performed using image comparison or using quantitative comparisons based on charge levels measured within each pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.