Method and apparatus for processing substrate
US6238511A · kind A · utility
15Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 1998 |
| Grant date | May 29, 2001 |
| Priority date | — |
| Expiry date | Aug 26, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1116
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of processing a substrate for removing a coating film from a substrate by dissolving the coating film with a solvent, comprising the steps of (a) supplying a solvent independently to each of peripheral portions of an upper surface side and a lower surface side of the substrate, and (b) supplying the solvent to the peripheral portion of the lower surface side of the substrate in an amount lower than the solvent supplied to the peripheral portion of the lower surface side in the step (a) or lower than that supplied to the peripheral portion of the upper surface side in this step (b), or terminating a supply of the solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.