Patent · US Expired

Microelectric lead structures with plural conductors

US6239384A · kind A · utility

209Cited by
11References
35Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 9, 1998
Grant dateMay 29, 2001
Priority date
Expiry dateFeb 9, 2018

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K1/118
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A microelectronic connection component has flexible leads formed by polymeric strips with metallic conductors thereon. The metallic conductors may be very thin, desirably less than 5 microns thick, and provide good fatigue resistance. Each strip may have two conductors thereon, one serving as a principal or first signal conductor for connection to a first contact on a chip or other microelectronic element and the other serving as potential reference or ground conductor, or as a second signal conductor connected to a second contact on the chip. The system provides enhanced resistance to crosstalk and rapid signal transmission, and is compatible with differential signal transmission.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.