System for dislodging by-product agglomerations from a polishing pad of a chemical mechanical polishing machine
US6241587A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 13, 1998 |
| Grant date | Jun 5, 2001 |
| Priority date | — |
| Expiry date | Feb 13, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B1/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system for dislodging by-product agglomerations from a polishing pad of a chemical mechanical polishing (CMP) machine. The present invention is used in conjunction with a CMP machine that polishes semiconductor wafers. Specifically, an embodiment of the dislodging system in accordance with the present invention includes a megasonic nozzle which is adapted to effectively dislodge polishing by-product agglomerations and particles from the grooves and micro-pits of the surface of a polishing pad through the application of an output stream of extremely agitated fluid (e.g., deionized water). One embodiment of the megasonic nozzle in accordance with the present invention includes two piezoelectric transducers which operate at a resonant frequency to produce the extremely agitated stream of fluid. A fluid line is connected to the megasonic nozzle and a fluid source in order to convey fluid to the megasonic nozzle. Within one embodiment of the present invention, a megasonic nozzle is mounted on a conditioner arm of a CMP machine near the end effector. As the polishing pad of the CMP machine rotates, the megasonic nozzle and the end effector translationally move towards and away from the…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.