Method and apparatus for chemical mechanical polishing using a patterned pad
US6241596A · kind A · utility
66Cited by
9References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2000 |
| Grant date | Jun 5, 2001 |
| Priority date | — |
| Expiry date | Jan 14, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad for use in a chemical mechanical polishing system is provided. The pad comprises a patterned surface having slurry distribution/retaining grooves formed therein. The slurry distribution/retaining grooves include a uniform or random pattern of non-continuous or obstructed groove segments adapted to inhibit slurry or other fluids from flowing off of the pad during operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.