High density wire bond BGA
US6242279A · kind A · utility
72Cited by
12References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 1999 |
| Grant date | Jun 5, 2001 |
| Priority date | — |
| Expiry date | Jun 14, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4644
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A new method is provided for creating high-density packages for wire bonded chips. The invention uses a combination of BUM technology and thin film deposition techniques to create the required interface between the contact points of the BGA device and the contact balls of the BGA substrate. Cavities are created on the metal panel substrates for IC chip insertion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.