Anna Litza
4Patents
3h-index
9Co-inventors
43Inventor score
Filing activity: Jun 14, 1999 → Jan 15, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6242279A | High density wire bond BGA | Electricity | 72 | Expired |
| US7382142B2 | High density interconnect system having rapid fabrication cycle | Emerging Cross-Sectional Technologies | 35 | Expired |
| US7872482B2 | High density interconnect system having rapid fabrication cycle | Emerging Cross-Sectional Technologies | 15 | Active |
| US7884634B2 | High density interconnect system having rapid fabrication cycle | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.