Thin Film Module, Inc.
13Patents
0Active
13Granted
30Portfolio score
Filing activity: Jun 14, 1999 → Aug 21, 2003
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6242279A | High density wire bond BGA | Electricity | 72 | Expired |
| US6320256A | Quick turn around fabrication process for packaging substrates and high density cards | Electricity | 54 | Expired |
| US6753600B1 | Structure of a substrate for a high density semiconductor package | Electricity | 28 | Expired |
| US6277672A | BGA package for high density cavity-up wire bond device connections using a metal panel, thin film and build up multilayer technology | Electricity | 21 | Expired |
| US6221693A | High density flip chip BGA | Electricity | 16 | Expired |
| US6562656B1 | Cavity down flip chip BGA | Electricity | 14 | Expired |
| US6287890A | Low cost decal material used for packaging | Electricity | 11 | Expired |
| US6331447A | High density flip chip BGA | Electricity | 9 | Expired |
| US6291268A | Low cost method of testing a cavity-up BGA substrate | Electricity | 7 | Expired |
| US6294477A | Low cost high density thin film processing | Electricity | 7 | Expired |
| US6197614A | Quick turn around fabrication process for packaging substrates and high density cards | Electricity | 6 | Expired |
| US6455926B2 | High density cavity-up wire bond BGA | Electricity | 4 | Expired |
| US6586846B2 | Low cost decal material used for packaging | Electricity | 4 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.