Method of interconnecting an electronic device

US6242280A · kind A · utility

Assignee

• AGILENT TECHNOLOGIES, INC. · US

Inventors

• Huck Khim Koay · Bukit Mertajam, MY
• Cheng Why Tan · Bukit Mertajam, MY
• Chee-Keong Chong · Merang, MY
• Gurbir Singh · Gig Harbor, US
• Sundar Yoganandan · Bukit Mertajam, MY
• Seong Choon Lim · Bukit Mertajam, MY

Key dates

• Filing date: Jun 30, 1999
• Grant date: Jun 5, 2001
• Expiry date: Jun 30, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of interconnecting bond pads on a semiconductor die to leads of a package is disclosed. The method includes placing a connector over each bond pad and its corresponding lead. The connector is one of a plurality of ganged connectors. The method also includes electrically connecting the connector to the bond pad and the lead and singularizing the connector from the plurality of ganged connectors. Such a method of interconnection has the advantage of simultaneously interconnecting multiple bond pads to leads. In a preferred embodiment, light-emitting diodes (LEDs) are manufactured using the method. A PCB is etched to produced lead pairs of the LEDs. A semiconductor die is attached to a first lead of each lead pair. Ganged interconnects are aligned with and tagged onto the dies and the second leads of the lead pairs, thereby electrically connecting them. After tagging, the interconnects are singularized. An encapsulant is applied on each die and interconnect. Each die, interconnect and lead pair are then separated to form individual LEDs.