Buffer station on CMP system
US6244931A · kind A · utility
18Cited by
9References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 1999 |
| Grant date | Jun 12, 2001 |
| Priority date | — |
| Expiry date | Apr 2, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/345
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing system is provided having a buffer station disposed therein or adjacent thereto. The buffer station includes two or more substrate supports for supporting two or more substrates adjacent to an inspection station. The two or more substrate supports are mounted on a mounting plate which is connected to an actuator for moving a pair of substrate supports laterally towards or away from each other over the inspection station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.