Arulkumar Shanmugasundram
40Patents
16h-index
63Co-inventors
80Inventor score
Filing activity: Apr 2, 1999 → Nov 8, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7341633B2 | Apparatus for electroless deposition | Emerging Cross-Sectional Technologies | 227 | Expired |
| US6913938B2 | Feedback control of plasma-enhanced chemical vapor deposition processes | Emerging Cross-Sectional Technologies | 83 | Expired |
| US7082345B2 | Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities | Emerging Cross-Sectional Technologies | 63 | Expired |
| US7201936B2 | Method of feedback control of sub-atmospheric chemical vapor deposition processes | Emerging Cross-Sectional Technologies | 44 | Expired |
| US7337019B2 | Integration of fault detection with run-to-run control | Emerging Cross-Sectional Technologies | 42 | Expired |
| US6999836B2 | Method, system, and medium for handling misrepresentative metrology data within an advanced process control system | Physics | 39 | Expired |
| US7783375B2 | Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing | Emerging Cross-Sectional Technologies | 34 | Active |
| US7725208B2 | Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing | Emerging Cross-Sectional Technologies | 33 | Active |
| US7256111B2 | Pretreatment for electroless deposition | Electricity | 33 | Expired |
| US7223323B2 | Multi-chemistry plating system | Electricity | 31 | Expired |
| US7160739B2 | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles | Emerging Cross-Sectional Technologies | 29 | Expired |
| US7272459B2 | Method, system and medium for controlling manufacture process having multivariate input parameters | Emerging Cross-Sectional Technologies | 28 | Expired |
| US7047099B2 | Integrating tool, module, and fab level control | Emerging Cross-Sectional Technologies | 27 | Expired |
| US7514353B2 | Contact metallization scheme using a barrier layer over a silicide layer | Electricity | 25 | Active |
| US7024268B1 | Feedback controlled polishing processes | Emerging Cross-Sectional Technologies | 20 | Expired |
| US6244931A | Buffer station on CMP system | Performing Operations; Transporting | 18 | Expired |
| US7651934B2 | Process for electroless copper deposition | Electricity | 16 | Active |
| US7247080B1 | Feedback controlled polishing processes | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6413145B1 | System for polishing and cleaning substrates | Electricity | 15 | Expired |
| US7698012B2 | Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6625513B1 | Run-to-run control over semiconductor processing tool based upon mirror image target | Emerging Cross-Sectional Technologies | 14 | Expired |
| US7827930B2 | Apparatus for electroless deposition of metals onto semiconductor substrates | Electricity | 14 | Active |
| US7659203B2 | Electroless deposition process on a silicon contact | Electricity | 11 | Expired |
| US7654221B2 | Apparatus for electroless deposition of metals onto semiconductor substrates | Chemistry; Metallurgy | 9 | Active |
| US8308858B2 | Electroless deposition process on a silicon contact | Electricity | 9 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.