Printed circuit board for ball grid array semiconductor packages
US6246015A · kind A · utility
Assignees
Inventor
Key dates
| Filing date | Jan 29, 1999 |
| Grant date | Jun 12, 2001 |
| Priority date | — |
| Expiry date | Jan 29, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed circuit board for BGA semiconductor packages has structure for effectively grounding the PCB to a grounded mold during molding of the package, thus preventing any accumulation of electrostatic charge on the package, and hence, any damage to the semiconductor chips, bonding wires or conductive traces in the packages caused by a rapid discharge of such an accumulated charge. The grounding means may comprise a flat grounding pad, a raised grounding boss, and/or a plated-through, grounding tooling hole on the board. The grounding pad or boss is electrically connected to a ground via hole and/or a ground trace on the board, and is located outside of a package separation line formed on a surface of the PCB. The grounding tooling hole is internally plated with a conductive metal layer to make electrical contact with conductive tooling pins that extend between the molds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.