Anam Semiconductor
55Patents
0Active
55Granted
35Portfolio score
Filing activity: Nov 14, 1996 → Jun 30, 2004
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6303997A | Thin, stackable semiconductor packages | Electricity | 437 | Expired |
| US6281568A | Plastic integrated circuit device package and leadframe having partially undercut leads and die pad | Emerging Cross-Sectional Technologies | 366 | Expired |
| US5866939A | Lead end grid array semiconductor package | Electricity | 296 | Expired |
| US6369454B1 | Semiconductor package and method for fabricating the same | Electricity | 212 | Expired |
| US6258629A | Electronic device package and leadframe and method for making the package | Electricity | 191 | Expired |
| US5908317A | Method of forming chip bumps of bump chip scale semiconductor package | Electricity | 91 | Expired |
| US5953589A | Ball grid array semiconductor package with solder balls fused on printed circuit board and method for fabricating the same | Electricity | 79 | Expired |
| US5854511A | Semiconductor package including heat sink with layered conductive plate and non-conductive tape bonding to leads | Electricity | 79 | Expired |
| US6150709A | Grid array type lead frame having lead ends in different planes | Electricity | 76 | Expired |
| US6268568A | Printed circuit board with oval solder ball lands for BGA semiconductor packages | Emerging Cross-Sectional Technologies | 72 | Expired |
| US6339252B1 | Electronic device package and leadframe | Electricity | 63 | Expired |
| US6414396B1 | Package for stacked integrated circuits | Electricity | 54 | Expired |
| US5864470A | Flexible circuit board for ball grid array semiconductor package | Electricity | 53 | Expired |
| US6091141A | Bump chip scale semiconductor package | Electricity | 39 | Expired |
| US6246015A | Printed circuit board for ball grid array semiconductor packages | Electricity | 26 | Expired |
| US5981873A | Printed circuit board for ball grid array semiconductor package | Electricity | 25 | Expired |
| US6339004B1 | Method of forming shallow trench isolation for preventing torn oxide | Electricity | 19 | Expired |
| US5971734A | Mold for ball grid array semiconductor package | Electricity | 18 | Expired |
| US6821877B1 | Method of fabricating metal interconnection of semiconductor device | Electricity | 17 | Expired |
| US6255176A | Method of forming trench for semiconductor device isolation | Electricity | 16 | Expired |
| US5897334A | Method for reproducing printed circuit boards for semiconductor packages including poor quality printed circuit board units and method for fabricating semiconductor packages using the reproduced printed circuit boards | Electricity | 15 | Expired |
| US6426277B1 | Methods and a device for heat treating a semiconductor wafer having different kinds of impurities | Electricity | 13 | Expired |
| US6021563A | Marking Bad printed circuit boards for semiconductor packages | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6727157B2 | Method for forming a shallow trench isolation using air gap | Electricity | 9 | Expired |
| US6794702B2 | Semiconductor device and fabrication method thereof | Electricity | 8 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.