Universal lead frame type of quad flat non-lead package of semiconductor
US6246111A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2000 |
| Grant date | Jun 12, 2001 |
| Priority date | — |
| Expiry date | Jan 25, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An universal lead frame type of Quad Flat Non-Lead package of semiconductor comprises a chip, a plurality of leads, a heat sink, and a molding compound. The leads are disposed at the periphery of the chip. The chip has its back surface bonded to the top surface of the heat sink, and the periphery of the top surface of the heat sink has a plurality of projections. The bonding portion at the periphery on the bottom surface of the heat sink is bonded to the top surface of the leads. The protruded portion at the center of the bottom surface of the heat sink is disposed in the opening region such that the bottom surface of the heat sink and the bottom surface of the leads are coplaner. The bonding pads of the chip are electrically connected to the top surface of the leads by a plurality of bonding wires. The molding compound encapsulates the chip, the heat sink, the top surface of the leads, and the bonding wires while exposes the protruded portion of the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.