Eric Ko
13Patents
11h-index
14Co-inventors
69Inventor score
Filing activity: Oct 28, 1980 → Jan 3, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6198171A | Thermally enhanced quad flat non-lead package of semiconductor | Electricity | 288 | Expired |
| US6414385B1 | Quad flat non-lead package of semiconductor | Electricity | 277 | Expired |
| US6667546B2 | Ball grid array semiconductor package and substrate without power ring or ground ring | Electricity | 187 | Expired |
| US6282094A | Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same | Emerging Cross-Sectional Technologies | 117 | Expired |
| US6246111A | Universal lead frame type of quad flat non-lead package of semiconductor | Electricity | 67 | Expired |
| US6265763A | Multi-chip integrated circuit package structure for central pad chip | Electricity | 44 | Expired |
| US6281578A | Multi-chip module package structure | Electricity | 28 | Expired |
| US6555296B2 | Fine pitch wafer bumping process | Electricity | 22 | Expired |
| US6427976B1 | Lead-frame-based chip-scale package and method of manufacturing the same | Electricity | 21 | Expired |
| US4695164A | Position detector and mount therefor for a centrifugal analyzer | Physics | 13 | Expired |
| US6306682A | Method of fabricating a ball grid array integrated circuit package having an encapsulating body | Electricity | 12 | Expired |
| US6177892A | EFM/DVD demodulator | Electricity | 11 | Expired |
| US4398198A | Pulse-hyperbolic location system using three passive beacon measurements | Physics | 8 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.