Semiconductor die de-processing using a die holder and chemical mechanical polishing
US6248001A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 1999 |
| Grant date | Jun 19, 2001 |
| Priority date | — |
| Expiry date | Aug 6, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1798
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for removing layers from a circuit side of a semiconductor die includes the use of a holder, for example a semiconductor wafer having an opening therein for receiving the semiconductor die. Additionally the holder can include one or more layers thereover which are removed at a similar rate as those layers which comprise the semiconductor die. A die is placed into the opening and a circuit side of the die is aligned with a front side of the holder, for example using a generally planar surface, and is secured to the holder with an adhesive material. Using a holder reduces uneven layer removal which is known to occur in conventional processing, for example excessive removal at the edges of the die. A potting jig which aids in aligning and securing the die to the holder is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.