Nozzle arm movement for resist development
US6248175A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1999 |
| Grant date | Jun 19, 2001 |
| Priority date | — |
| Expiry date | Oct 29, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/3021
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system and method is provided that facilitates the application of a uniform layer of developer material on a photoresist material layer. The system includes a nozzle adapted to apply a predetermined volume of developer material on a photoresist material layer along a linear path having a length approximately equal to the diameter of the photoresist material layer. A movement system moves the nozzle to a first position offset from a central region of the photoresist material layer for applying a first predetermined volume of developer material to the photoresist material layer while the developer material is spin coated. The movement system also moves the nozzle to a second position offset from the central region for applying a second predetermined volume of developer material to the photoresist material layer while the developer is spin coated. The first position is located on an opposite side of the central region with respect to the second position. A method of adjusting the offset position and/or volume of developer material applied at the first and second position is also provided. The method utilizes developed photoresist material layer thickness data provided by a measureme…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.