Khoi A. Phan
101Patents
20h-index
47Co-inventors
90Inventor score
Filing activity: Dec 19, 1997 → Nov 16, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6844206B1 | Refractive index system monitor and control for immersion lithography | Physics | 73 | Expired |
| US6222936A | Apparatus and method for reducing defects in a semiconductor lithographic process | Physics | 63 | Expired |
| US6665065B1 | Defect detection in pellicized reticles via exposure at short wavelengths | Physics | 57 | Expired |
| US5985497A | Method for reducing defects in a semiconductor lithographic process | Physics | 57 | Expired |
| US6513151B1 | Full flow focus exposure matrix analysis and electrical testing for new product mask evaluation | Physics | 56 | Expired |
| US6171737A | Low cost application of oxide test wafer for defect monitor in photolithography process | Electricity | 50 | Expired |
| US6784446B1 | Reticle defect printability verification by resist latent image comparison | Physics | 45 | Expired |
| US6594024B1 | Monitor CMP process using scatterometry | Electricity | 42 | Expired |
| US7262422B2 | Use of supercritical fluid to dry wafer and clean lens in immersion lithography | Physics | 36 | Expired |
| US7065737B2 | Multi-layer overlay measurement and correction technique for IC manufacturing | Electricity | 33 | Expired |
| US6063531A | Focus monitor structure and method for lithography process | Physics | 33 | Expired |
| US6570157B1 | Multi-pitch and line calibration for mask and wafer CD-SEM system | Electricity | 30 | Expired |
| US7187796B1 | Systems and methods that employ exposure compensation to provide uniform CD control on reticle during fabrication | Physics | 29 | Expired |
| US6654660B1 | Controlling thermal expansion of mask substrates by scatterometry | Physics | 28 | Expired |
| US7224456B1 | In-situ defect monitor and control system for immersion medium in immersion lithography | Physics | 27 | Expired |
| US6453916B1 | Low angle solvent dispense nozzle design for front-side edge bead removal in photolithography resist process | Emerging Cross-Sectional Technologies | 26 | Expired |
| US7148142B1 | System and method for imprint lithography to facilitate dual damascene integration in a single imprint act | Electricity | 25 | Expired |
| US6556303B1 | Scattered signal collection using strobed technique | Electricity | 24 | Expired |
| US6510730B1 | System and method for facilitating selection of optimized optical proximity correction | Emerging Cross-Sectional Technologies | 22 | Expired |
| US6954678B1 | Artificial intelligence system for track defect problem solving | Physics | 21 | Expired |
| US5886909A | Defect diagnosis using simulation for IC yield improvement | Electricity | 20 | Expired |
| US6248175A | Nozzle arm movement for resist development | Physics | 20 | Expired |
| US7158896B1 | Real time immersion medium control using scatterometry | Physics | 20 | Expired |
| US6559457B1 | System and method for facilitating detection of defects on a wafer | Electricity | 20 | Expired |
| US6270579A | Nozzle arm movement for resist development | Physics | 20 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.