Ceramics substrate with electronic circuit and its manufacturing method
US6248960A · kind A · utility
2Cited by
12References
9Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 10, 2000 |
| Grant date | Jun 19, 2001 |
| Priority date | — |
| Expiry date | Feb 10, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/25
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a ceramic wiring board which comprises a copper via, breaks and defects of via interconnections resulting from enlargement of copper particles in the interior of the via during sintering, are prevented. For this purpose, alumina of mean particle diameter from 1 .mu.m to 4 .mu.m is disposed in the interior of the via interconnection after sintering at an average interval of 7.4 .mu.m or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.