Tented plated through-holes and method for fabrication thereof
US6249045A · kind A · utility
6Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 1999 |
| Grant date | Jun 19, 2001 |
| Priority date | — |
| Expiry date | Oct 12, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1394
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuitized substrate having plated through-holes wherein the plated through-holes are, tented with a polyimide material is provided along with the process for fabricating such.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.