Substrate processing apparatus and substrate processing method
US6251189A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2000 |
| Grant date | Jun 26, 2001 |
| Priority date | — |
| Expiry date | Feb 11, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S156/912
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention is constituted so as to improve a quartz gas supply portion utilized in a normal pressure furnace, and to keep to a minimum the damage incurred by a normal pressure furnace by the shock from an earthquake. Quartz gas supply piping 25 for supplying a reactant gas is connected to a quartz reaction tube 4, which constitutes a furnace body. A stress concentration portion 23 for concentrating stress by prioritizing another location when vibration occurs in a furnace body is formed on this gas supply piping 25. The stress concentration portion 23 is disposed on the side of a source-side gas supply pipe 8, which is in front of a pipe clamp 21 that connects the source-side gas supply pipe 8 to a reaction tube-side gas supply pipe 7 mounted to the reaction tube 4. As a stress concentration portion 23, the simplest of V-grooves can be formed in the circumferential direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.