Patent · US Expired

Apparatus and method for heating a liquid or viscous polishing agent, and device for polishing wafers

US6257955A · kind A · utility

21Cited by

9References

24Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Gotz Springer · Dresden, DE
Wolfgang Diewald · Fontainebleau, FR
Andre Richter · Neustadt in Sachsen, DE

Key dates

Filing date	Feb 29, 2000
Grant date	Jul 10, 2001
Priority date	—
Expiry date	Feb 29, 2020

Classification

Technology area (CPC F)Mechanical Engineering; Lighting; Heating
CPC primaryF28F9/0132
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

An apparatus for polishing wafers includes a polishing table with a heating device. A conduit connects a tank holding a liquid polishing agent to a distributor for feeding the liquid polishing agent to the polishing table. A heat exchanger is disposed along the conduit between the tank and the distributor for heating the liquid polishing agent. The heat exchanger is independent of said heating device. A method for heating a polishing agent is also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.