Assembly for wafer handling system
US6260894A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 1999 |
| Grant date | Jul 17, 2001 |
| Priority date | — |
| Expiry date | May 28, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A blade assembly for a mechanical wafer handling system. The assembly includes an elongated planar member having a central region, wherein the central region has a first array of openings and a second array of openings, the openings of the first array being arranged substantially symmetrically to the openings of the second array on opposing sides of a central longitudinal axis extending along the length of the planar member and passing through a center point of the central region. The openings in the first array are arranged substantially symmetrically with respect to a perpendicular axis extending along the width of the elongated planar member and passing through a center point of the central region. The openings in the second array are also arranged substantially symmetrically with respect to the perpendicular axis. The assembly also includes a wrist with a wrist upper cap and a wrist lower cap. The wrist upper cap has a first and a second wing support on two opposing sides of the upper cap and a first non-supporting narrow ridge extending between the first and second wing supports. The wrist lower cap has a third and a fourth wing support on two opposing sides of the lower cap w…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.