Heat treatment method, heat treatment apparatus and treatment system
US6261365A · kind A · utility
16Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 1999 |
| Grant date | Jul 17, 2001 |
| Priority date | — |
| Expiry date | Mar 19, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
When a substrate coated with a coating solution which oxidizes at high temperatures is heat-treated, an oxygen concentration of a treatment atmosphere is lowered when the temperature is low. Next, the substrate is heat-treated in the treatment atmosphere of which the oxygen concentration is lowered. Sequentially, the treatment atmosphere is returned to that with the original oxygen concentration after the passage of a predetermined time after completing the heat treatment. Thereby, the substrate can be heat-treated, with the oxidization of the coating solution being controlled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.