Method and apparatus for removal of thin films from wafers

US6261407A · kind A · utility

Assignee

• Lam Research Corporation · US

Inventors

• Helmuth Treichel · Augsburg, DE
• Michael Ravkin · Sunnyvale, US
• Don E. Anderson · San Jose, US
• John M. de Larios · Palo Alto, US

Key dates

• Filing date: Jun 29, 1999
• Grant date: Jul 17, 2001
• Expiry date: Jun 29, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67075
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method and apparatus for processing a wafer are described. In one embodiment, a method for processing a wafer comprises applying a sealing mechanism to the wafer to create multiple separate, sealed portions of the wafer, and applying a plurality of different chemistries to multiple separate, sealed portions of the wafer through the sealing mechanism.