Method of modifying a microchip layout data set to generate a predicted mask printed data set
US6261724A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1999 |
| Grant date | Jul 17, 2001 |
| Priority date | — |
| Expiry date | Jun 16, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70441
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method is presented here that enables one to improve the prediction for the printed structures of circuit patterns in a microchip, thereby potentially aiding in the design of the microchip circuitry. This method comprises the steps of determining, by applying process bias and corner curvature rules to a real mask image, a simulated structure for the mask used in optical projection lithography; and determining, by applying optical and process proximity correction rules to said simulated mask structure, a more accurate prediction for the structures printed on the wafer. Preferably the simulated mask structure is determined by applying a symmetric bias consistent with a mask build process to the real mask image, adjusting predetermined features of the real mask image such as corners or narrow lines, and applying a reverse symmetric bias to the adjusted real mask image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.