Repair process for aluminum nitride substrates
US6262390A · kind A · utility
48Cited by
10References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1998 |
| Grant date | Jul 17, 2001 |
| Priority date | — |
| Expiry date | Dec 14, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2111/00844
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method to repair Aluminum Nitride (AlN) substrates is disclosed wherein a frequency doubled Q-switched Nd:YAG laser is used to remove unwanted metallurgy. The substrate is place in a liquid filled work chamber which acts to prevent metallic species of AlN from forming. The repair site can be sealed with a novel polymer coating to prevent contamination or corrosion. Repairs can be made to buried or surface metallurgy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.