Ball grid array electronic package
US6262477A · kind A · utility
53Cited by
41References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 1993 |
| Grant date | Jul 17, 2001 |
| Priority date | — |
| Expiry date | Mar 19, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0999
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a ball grid array package for housing semiconductor devices. The package has a metallic base with conductive vias extending through holes formed in the base. The conductive vias terminate adjacent an exterior surface of the base. A dielectric coating on at least part of the base and through hole walls electrically isolates the metallic base from the package circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.