Method and apparatus for controlling byproduct induced defect density
US6263590A · kind A · utility
5Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 12, 1999 |
| Grant date | Jul 24, 2001 |
| Priority date | — |
| Expiry date | Jul 12, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4401
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for reducing byproduct induced defects in a processing tool is provided. A purge gas is introduced into a vessel of the processing tool. The vessel is heated to a temperature above a vaporization temperature of the byproduct. The temperature is maintained for a predetermined period of time. The vessel is purged to remove at least a portion of the byproduct.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.