Plasma treatment method and apparatus
US6264788A · kind A · utility
78Cited by
11References
3Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 21, 2000 |
| Grant date | Jul 24, 2001 |
| Priority date | — |
| Expiry date | Apr 21, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S156/916
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plasma treatment method comprising exhausting a process chamber so as to decompress the process chamber, mounting a wafer on a suscepter, supplying a process gas to the wafer through a shower electrode, applying high frequency power, which has a first frequency f.sub.1 lower than an inherent lower ion transit frequencies of the process gas, to the suscepter, and applying high frequency power, which has a second frequency f.sub.2 higher than an inherent upper ion transit frequencies of the process gas, whereby a plasma is generated in the process chamber and activated species influence the water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.