Plating fluid replenishment system and method
US6264806A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 7, 1999 |
| Grant date | Jul 24, 2001 |
| Priority date | — |
| Expiry date | Oct 7, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05D11/138
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plating chemical replenishment system is described having a tank for supporting a chemical solution used in a plating fluid, a container having a pre-determined volume, a first valve for selectively coupling the chemical solution from the tank to the container to form a pre-determined volume of the chemical solution within the container, and a second valve for selectively dispensing the pre-determined volume of the chemical solution from the container to a plating fluid reservoir. Also disclosed is a method of dispensing a plating solution to a plating fluid reservoir, comprising the steps of forming a pre-determined volume of the plating solution; and dispensing the pre-determined volume of the plating solution to the plating fluid reservoir. In addition, a plating system is provided for plating a surface of an article, comprising a plating fluid tank for supporting a plating fluid reservoir, a plating apparatus for using plating fluid from the plating fluid reservoir to plate the surface of the article; and a plating chemical replenishment system. The replenishment system has a chemical solution tank for supporting a chemical solution used in a plating fluid; a container having…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.