Robert Kaufman
16Patents
6h-index
5Co-inventors
55Inventor score
Filing activity: Mar 29, 1988 → Aug 15, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6251238A | Anode having separately excitable sections to compensate for non-uniform plating deposition across the surface of a wafer due to seed layer resistance | Emerging Cross-Sectional Technologies | 53 | Expired |
| US6197182A | Apparatus and method for plating wafers, substrates and other articles | Emerging Cross-Sectional Technologies | 51 | Expired |
| US4931330A | Prefabricated, slip-resistant surface coating | Emerging Cross-Sectional Technologies | 22 | Expired |
| US5773143A | Activated carbon coated ceramic fibers | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6299751A | Apparatus and method for plating wafers, substrates and other articles | Emerging Cross-Sectional Technologies | 10 | Expired |
| US6296753A | Apparatus and method for plating wafers, substrates and other articles | Emerging Cross-Sectional Technologies | 6 | Expired |
| US5323301A | Dimmable studio lighting device | Mechanical Engineering; Lighting; Heating | 4 | Expired |
| US6264806A | Plating fluid replenishment system and method | Physics | 4 | Expired |
| US6274024A | Apparatus and method for plating wafers, substrates and other articles | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6277260A | Apparatus and method for plating wafers, substrates and other articles | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6274023A | Apparatus and method for electroplating wafers, substrates and other articles | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6322313A | Apparatus and method for inserting a wafer, substrate or other article into a process module | Electricity | 0 | Expired |
| US6267862A | Apparatus and method for plating wafers, substrates and other articles | Emerging Cross-Sectional Technologies | 0 | Expired |
| US6419805B1 | Apparatus for plating wafers, substrates and other articles | Emerging Cross-Sectional Technologies | 0 | Expired |
| US6287443A | Apparatus and method for electroplating wafers, substrates and other articles | Emerging Cross-Sectional Technologies | 0 | Expired |
| US6361669B1 | Apparatus and method for plating wafers, substrates and other articles | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.