Dual chip with heat sink
US6265771A · kind A · utility
113Cited by
23References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 1999 |
| Grant date | Jul 24, 2001 |
| Priority date | — |
| Expiry date | Jan 27, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for simultaneously removing heat from two surfaces of a semiconductor structure includes a heat sink mounted to a front surface and a heat sink mounted to a back surface of the semiconductor structure. The structure can be two chips mounted in face-to-face arrangement, and the heat sinks remove heat from back surfaces of both chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.