Methods and solutions for cleaning polished aluminum-containing layers, methods for making metallization structures, and the structures resulting from these methods
US6265781A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 15, 1998 |
| Grant date | Jul 24, 2001 |
| Priority date | — |
| Expiry date | Sep 15, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for making an aluminum-containing metallization structure, methods and solutions for cleaning a polished aluminum-containing layer, and the structures formed by these methods. The methods for making the aluminum-containing metallization structure are practiced by providing a substrate, forming a metal layer with an upper surface containing aluminum over the substrate, polishing the metal layer, and contacting the polished surface of the metal layer with a solution comprising water and at least one corrosion-inhibiting agent. The method for cleaning the polished aluminum-containing layer is practiced by contacting a polished aluminum-containing layer with a solution comprising water and a corrosion-inhibiting agent. In these methods and solutions, the water may be deionized water, the corrosion-inhibiting agent may be citric acid or one of its salts, and the solution may contain additional additives, such as chelating agents, buffers, oxidants, anti-oxidants, and surfactants. These methods and solutions reduce the corrosion caused by DI water used in cleaning polished aluminum-containing layers and maintain a passivative environment which protects the exposed aluminum struct…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.