Inventor · Boise, ID, US

Michael T. Andreas

45Patents
14h-index
10Co-inventors
78Inventor score

Filing activity: Oct 3, 1996 → Feb 5, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US5895550A Ultrasonic processing of chemical mechanical polishing slurries Emerging Cross-Sectional Technologies 102 Expired
US5855811A Cleaning composition containing tetraalkylammonium salt and use thereof in semiconductor fabrication Emerging Cross-Sectional Technologies 77 Expired
US6124207A Slurries for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods and apparatuses for making and using such slurries Performing Operations; Transporting 69 Expired
US6265781A Methods and solutions for cleaning polished aluminum-containing layers, methods for making metallization structures, and the structures resulting from these methods Electricity 57 Expired
US6044851A Cleaning composition containing tetraalkylammonium salt and use thereof in semiconductor fabrication Emerging Cross-Sectional Technologies 49 Expired
US6358325B1 Polysilicon-silicon dioxide cleaning process performed in an integrated cleaner with scrubber Emerging Cross-Sectional Technologies 37 Expired
US6077785A Ultrasonic processing of chemical mechanical polishing slurries Emerging Cross-Sectional Technologies 32 Expired
US5963814A Method of forming recessed container cells by wet etching conductive layer and dissimilar layer formed over conductive layer Electricity 30 Expired
US6375548B1 Chemical-mechanical polishing methods Electricity 22 Expired
US6269511A Surface cleaning apparatus Emerging Cross-Sectional Technologies 20 Expired
US6787473B2 Post-planarization clean-up Emerging Cross-Sectional Technologies 19 Expired
US6468951B1 Cleaning composition containing tetraalkylammonium salt and use thereof in semiconductor fabrication Emerging Cross-Sectional Technologies 18 Expired
US6273100A Surface cleaning apparatus and method Emerging Cross-Sectional Technologies 18 Expired
US9653307B1 Surface modification compositions, methods of modifying silicon-based materials, and methods of forming high aspect ratio structures Electricity 17 Active
US6589882B2 Copper post-etch cleaning process Electricity 10 Expired
US6399492B1 Ruthenium silicide processing methods Electricity 10 Expired
US6635562B2 Methods and solutions for cleaning polished aluminum-containing layers Chemistry; Metallurgy 8 Expired
US7235494B2 CMP cleaning composition with microbial inhibitor Emerging Cross-Sectional Technologies 6 Expired
US6936540B2 Method of polishing a semiconductor substrate, post-CMP cleaning process, and method of cleaning residue from registration alignment markings Electricity 6 Expired
US6835668B2 Copper post-etch cleaning process Electricity 6 Expired
US7468105B2 CMP cleaning composition with microbial inhibitor Emerging Cross-Sectional Technologies 5 Expired
US7033978B2 Post-planarization clean-up Emerging Cross-Sectional Technologies 4 Expired
US6835121B2 Chemical-mechanical polishing methods Electricity 4 Expired
US6627550B2 Post-planarization clean-up Emerging Cross-Sectional Technologies 4 Expired
US6930017B2 Wafer Cleaning method and resulting wafer Emerging Cross-Sectional Technologies 3 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.