Molded window array for image sensor packages
US6266197A · kind A · utility
180Cited by
5References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1999 |
| Grant date | Jul 24, 2001 |
| Priority date | — |
| Expiry date | Dec 8, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Image sensor packages are fabricated simultaneously to minimize the cost associated with each individual image sensor package. To fabricate the image sensor packages, windows are molded in molding compound to form a molded window array. A substrate includes a plurality of individual substrates integrally connected together in an array format. Image sensors are attached and electrically connected to corresponding individual substrates. An adhesive layer attaches the molded window array to the substrate. The substrate and attached molded window array are singulated into a plurality of individual image sensor packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.