Inventor · Chandler, AZ, US

Steven Webster

136Patents
34h-index
65Co-inventors
93Inventor score

Filing activity: Nov 22, 1999 → Feb 5, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US6577013B1 Chip size semiconductor packages with stacked dies Electricity 334 Expired
US6943429B1 Wafer having alignment marks extending from a first to a second surface of the wafer Electricity 284 Expired
US6571466B1 Flip chip image sensor package fabrication method Emerging Cross-Sectional Technologies 224 Expired
US6503780B1 Wafer scale image sensor package fabrication method Electricity 194 Expired
US6407381B1 Wafer scale image sensor package Electricity 186 Expired
US6266197A Molded window array for image sensor packages Electricity 180 Expired
US6545345B1 Mounting for a package containing a chip Electricity 178 Expired
US6483101B1 Molded image sensor package having lens holder Emerging Cross-Sectional Technologies 153 Expired
US6424315B1 Semiconductor chip having a radio-frequency identification transceiver Emerging Cross-Sectional Technologies 146 Expired
US6686588B1 Optical module with lens integral holder Electricity 134 Expired
US6672773B1 Optical fiber having tapered end and optical connector with reciprocal opening Physics 117 Expired
US6791076B2 Image sensor package Emerging Cross-Sectional Technologies 105 Expired
US6734419B1 Method for forming an image sensor package with vision die in lens housing Electricity 98 Expired
US6441503B1 Bond wire pressure sensor die package Electricity 86 Expired
US6530515B1 Micromachine stacked flip chip package fabrication method Electricity 83 Expired
US6342406B1 Flip chip on glass image sensor package fabrication method Electricity 83 Expired
US6486545B1 Pre-drilled ball grid array package Electricity 78 Expired
US6448506B1 Semiconductor package and circuit board for making the package Electricity 77 Expired
US6492699B1 Image sensor package having sealed cavity over active area Electricity 72 Expired
US6455927B1 Micromirror device package Electricity 72 Expired
US6406934B1 Wafer level production of chip size semiconductor packages Electricity 72 Expired
US9030440B2 Capacitive sensor packaging Physics 65 Active
US6526653B1 Method of assembling a snap lid image sensor package Emerging Cross-Sectional Technologies 64 Expired
US6627864B1 Thin image sensor package Electricity 61 Expired
US6432737B1 Method for forming a flip chip pressure sensor die package Electricity 58 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.