Method of drying substrates and drying apparatus
US6269552A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 1998 |
| Grant date | Aug 7, 2001 |
| Priority date | — |
| Expiry date | Nov 17, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67034
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate transporting device and method 19 transports a plurality of wafers W standing upright in a row, from a previous process, i.e., a cleaning process. A substrate holder 40 is carried by a transporting device 50 arranged outside a drying chamber 20. The substrate holder 40 receives the wafers W from the substrate transporting device 19 while maintaining a posture of the wafers W. The transporting device 50 lowers the substrate holder 40 and sequentially moves it into the drying chamber 20 through an unloading and loading port 21 above the drying chamber 20. Thereafter, the substrate holder 40 is fixed to a rotor 30. After closing the unloading and loading port 21 with a lid body 25, the rotor 30 is rotated. In this way, moisture sticking to surfaces of the wafers W is eliminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.