Electroplating apparatus and method using a compressible contact

US6270646A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Erick G. Walton · South Burlington, US
• Dean S. Chung · South Burlington, US
• Lara Sandra Collins · Saint Albans, US
• William E. Corbin, Jr. · Newburgh, US
• Hariklia Deligianni · Alpine, US
• Daniel C. Edelstein · White Plains, US
• James E. Fluegel · Tivoli, US
• Josef W. Korejwa · Vergennes, US
• Peter S. Locke · New York, US
• Cyprian Emeka Uzoh · San Jose, US

Key dates

• Filing date: Dec 28, 1999
• Grant date: Aug 7, 2001
• Expiry date: Dec 28, 2019

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D5/06
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A metal plating apparatus is described which includes a compressible member having a conductive surface covering substantially all of the surface of the substrate to be plated. The plating current is thereby transmitted over a wide area of the substrate, rather than a few localized contact points. The compressible member is porous so as to absorb the plating solution and transmit the plating solution to the substrate. The wafer and compressible member may rotate with respect to each other. The compressible member may be at cathode potential or may be a passive circuit element.