Copper-aluminum metallization
US6271591A · kind A · utility
41Cited by
9References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 17, 1999 |
| Grant date | Aug 7, 2001 |
| Priority date | — |
| Expiry date | May 17, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating copper-aluminum metallization utilizing the technique of electroless copper deposition is described. The method provides a self-encapsulated copper-aluminum metallization structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.