Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface
US6273796A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 1, 1999 |
| Grant date | Aug 14, 2001 |
| Priority date | — |
| Expiry date | Sep 1, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B21/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.