Method to remove metals in a scrubber
US6274059A · kind A · utility
25Cited by
28References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 11, 1996 |
| Grant date | Aug 14, 2001 |
| Priority date | — |
| Expiry date | Mar 11, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B3/08
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method to remove metal contaminants in a substrate cleaning process. The present invention may replace or be used in conjunction with other substrate cleaning systems. This method comprises adding a citric acid solution to the liquid medium of a semiconductor substrate cleaning system. This method is described in the manner it is used in conjunction with a scrubber wherein both sides of a wafer are scrubbed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.