Manufacture of semiconductor connection components with frangible lead sections
US6274822A · kind A · utility
8Cited by
19References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1998 |
| Grant date | Aug 14, 2001 |
| Priority date | — |
| Expiry date | Jul 2, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4092
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip connection component having numerous leads extending side-by-side across a gap in a support structure, each lead having a frangible section to permit detachment of one end of the lead from the support structure in a bonding process. The frangible sections are formed by treating the lead-forming material in an elongated treatment zone extending across the regions occupied by numerous leads to provide a step defining a fracture point of the lead during a wire bonding process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.