David Light
18Patents
8h-index
15Co-inventors
61Inventor score
Filing activity: Jul 2, 1998 → May 9, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6217972A | Enhancements in framed sheet processing | Emerging Cross-Sectional Technologies | 51 | Expired |
| US6825552B2 | Connection components with anisotropic conductive material interconnection | Electricity | 45 | Expired |
| US7152311B2 | Enhancements in framed sheet processing | Emerging Cross-Sectional Technologies | 22 | Expired |
| US6338982B1 | Enhancements in framed sheet processing | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6255723A | Layered lead structures | Electricity | 16 | Expired |
| US6333207A | Peelable lead structure and method of manufacture | Electricity | 11 | Expired |
| US6657286B2 | Microelectronic assembly formation with lead displacement | Electricity | 8 | Expired |
| US6248656A | Metal-jacketed lead manufacturing process using resist layers | Electricity | 8 | Expired |
| US6274822A | Manufacture of semiconductor connection components with frangible lead sections | Electricity | 8 | Expired |
| US6808958B2 | Methods of bonding microelectronic elements | Electricity | 6 | Expired |
| US6357112B1 | Method of making connection component | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7067742B2 | Connection component with peelable leads | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7098074B2 | Microelectronic assemblies having low profile connections | Electricity | 3 | Expired |
| US7205659B2 | Assemblies for temporarily connecting microelectronic elements for testing and methods therefor | Emerging Cross-Sectional Technologies | 1 | Expired |
| US7309447B2 | Method for making a microelectronic package using pre-patterned, reusable mold and method for making the mold | Electricity | 1 | Expired |
| US7696439B2 | Layered metal structure for interconnect element | Emerging Cross-Sectional Technologies | 1 | Active |
| US6794202B2 | Assemblies for temporarily connecting microelectronic elements for testing and methods therefor | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6518160B1 | Method of manufacturing connection components using a plasma patterned mask | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.