Heater for use in substrate processing
US6278089A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 2, 1999 |
| Grant date | Aug 21, 2001 |
| Priority date | — |
| Expiry date | Nov 2, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/748
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heater is provided for use in substrate processing. In a first aspect, the heater is formed from a heater plate including an upper surface having at least one recess formed therein, a heater element wire disposed within the at least one recess and an electrically insulating and thermally conductive material disposed within the at least one recess so as to electrically insulate the heater element wire from the heater plate. Preferably a plurality of recesses are formed within the upper surface, a heater element wire is disposed within each recess and an electrically insulating and thermally conductive material is disposed within each recess so as to electrically insulate the heater element wire within each recess from the heater plate. A plurality of heating zones thereby may be formed. The electrically insulating and thermally conductive material preferably comprises a material deposited within the recess so as to embed the heater element wire within the electrically insulating and thermally conductive material. The electrically insulating and thermally conductive material also may comprise a plurality of insulating beads that surround the heater element wire. In a second aspect …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.