Leadframe alteration to direct compound flow into package
US6278175A · kind A · utility
9Cited by
10References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 21, 2000 |
| Grant date | Aug 21, 2001 |
| Priority date | — |
| Expiry date | Jan 21, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe comprising a downset formed adjacent to an edge of the leadframe so as to direct the molding compound to flow evenly inside the mold cavity. The downset has an upward slope extending from the edge of the frame and levels off with the rest of the frame at a first transition point. The upward slope facilitates the upward flow of the molding compound entering from a bottom gate. Likewise, the leadframe also directs flow in a top gated mold by reversing the orientation of the leadframe or by forming a reverse downset on the leadframe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.