Solder disc connection
US6278184A · kind A · utility
15Cited by
18References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 1999 |
| Grant date | Aug 21, 2001 |
| Priority date | — |
| Expiry date | Sep 22, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.