Electrostatic chuck with improved temperature control and puncture resistance
US6278600A · kind A · utility
29Cited by
49References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 1999 |
| Grant date | Aug 21, 2001 |
| Priority date | — |
| Expiry date | Jan 13, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6833
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus for supporting a workpiece and method of making same. The apparatus comprises a flex circuit laminated to a contoured support pedestal. The flex circuit includes a reinforced layer to improve puncture resistance of the flex circuit. The top surface of the chuck has a contoured topography that is achieved by machining the upper surface of the pedestal prior to lamination of the flex circuit to the pedestal. The contoured topography improves the flow of backside cooling gas resulting in a more uniform wafer temperature profile.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.