Compliant bond structure for joining ceramic to metal
US6280584A · kind A · utility
91Cited by
7References
64Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 1998 |
| Grant date | Aug 28, 2001 |
| Priority date | — |
| Expiry date | Jul 29, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02N13/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A compliant bond structure 20 comprising wire mesh 25 strands 50 surrounded by compliant metal 40 is useful for bonding a ceramic surface 30 to a metal surface 35. The wire mesh 25 comprises interlocking strands 50 having longitudinal axes that are oriented substantially parallel to the ceramic and metal surfaces 30, 35. More preferably, the wire mesh 25 comprises strands having a coefficient of thermal expansion that is about 0.4 to about 1.6 times the average of the coefficients of thermal expansion of the metal and ceramic surfaces 30, 35.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.