Method for the manufacture of printed circuit boards with plated resistors
US6281090A · kind A · utility
34Cited by
3References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2000 |
| Grant date | Aug 28, 2001 |
| Priority date | — |
| Expiry date | Jun 27, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1453
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process is revealed whereby resistors can be manufactured integral with the printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are revealed as techniques for improving the uniformity and consistency of the plated resistors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.